THGBMHG6C1LBAIL1Jul. 31th, 2015TOSHIBA e-MMC Module8GB THGBMHG6C1LBAILINTRODUCTIONTHGBMHG6C1LBAIL is 8GB density of e-MMC Module product housed in 153 ball BGA package. This unit is utilizedadvanced TOSHIBA NAND flash device(s) and controller chip assembled as Multi Chip Module. THGBMHG6C1LBAILhas an industry standard MMC protocol for easy use.FEATURESTHGBMHG6C1LBAIL InterfaceTHGBMHG6C1LBAIL has the JEDEC/MMCA Version 5.1 interface with 1-I/O, 4-I/O and 8-I/O mode.Pin ConnectionP-WFBGA153-1113-0.50 (11.5mm x 13mm, H0.8mm max. package)Pin NumberNamePin NumberNamePin NumberNamePin NumberNameA3DAT0C2VDDiJ5VssN4VccQA4DAT1C4VssQJ10VccN5VssQA5DAT2C6VccQK5RST_nP3VccQA6VssE6VccK8VssP4VssQB2DAT3E7VssK9VccP5VccQB3DAT4F5VccM4VccQP6VssQB4DAT5G5VssM5CMDB5DAT6H5DSM6CLKB6DAT7H10VssN2VssQNC: No Connect, shall be connected to ground or left floating.RFU: Reserved for Future Use, shall be left floating for future use.VSF: Vendor Specific Function, shall be left floating.1413121110987654321ABCDEFGHJKLMNPindexTop ViewNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCNCRFUNCNCNCNCNCNCRFUNCNCNCNCRFUVssNCNCDAT7DAT2DAT1DAT6DAT5DAT0DAT4DAT3VccQVssQCLKCMDVccQVccQVssQVccQVssQVssQVccQVssQNCNCNCNCNCNCNCNCNCNCRFUNCNCNCNCNCNCNCNCNCNCNCVDDiRST_nVssDSVssVccVccRFUVSFVSFRFUVssVSFRFU VssVcc RFUVccVssRFURFUNCNC
